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Investigation on the Microstructure and Mechanical Properties of Stud Welded Joints of Cu/304 Austenitic Stainless Steel under Different Welding Voltages

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Abstract

In this study, stud welding of 304 austenitic stainless steel stud–copper plate was carried out at seventeen different welding voltages between 50 and 130 V. The microstructure, mechanical properties, electrical properties and fracture modes of the welded joints were investigated. Optical microscopy (OM), scanning electron microscopy (SEM), energy spectrometry (EDS) and x-ray diffractometry (XRD) were used to analyze the microstructure of the weld metal. The mechanical properties of the welded joints were examined by tensile and microhardness tests. The fracture pattern was confirmed by SEM after the tensile test. A DC resistance meter is used to test the change in resistance of the weld metal. The results showed that the increase in the welding voltage leads to the increase in the welded joint depth of fusion and tensile load. The elements within the weld metal were not uniformly distributed. The microhardness and resistance values of the weld metal were elevated compared to the copper plate, with an average microhardness value of 339 HV. In brief, the optimum welding voltage was determined to be 105-120 V.

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Acknowledgments

This work is supported by the Natural Science Foundation of Gansu Province, China (No. 20JR5RA416, 21JR7RA308) and the National Natural Science Foundation of China (No.51605384).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Lanzhou Jiaotong University, Anning west road, No 88, 730070, Lanzhou, People’s Republic of China

    **long Zhao, **nhong Lu & Feng He

  2. School of Civil Engineering, Lanzhou Jiaotong University, Lanzhou, People’s Republic of China

    Kun Wang

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Zhao, X., Lu, X., Wang, K. et al. Investigation on the Microstructure and Mechanical Properties of Stud Welded Joints of Cu/304 Austenitic Stainless Steel under Different Welding Voltages. J. of Materi Eng and Perform 32, 613–623 (2023). https://doi.org/10.1007/s11665-022-07123-6

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