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Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation

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Abstract

Special applications, such as microelectromechanical systems (MEMS), often require hermetic sealing in order to achieve a desired operation. Solid–liquid interdiffusion (SLID) bonding is an attractive method for encapsulating MEMS devices at the wafer-level, providing, e.g., high re-melt temperatures and tolerance for topographical variations. Several different SLID bond solutions have been investigated; however, there are only a limited number of published reliability studies available. In this paper, wafer-level Au-Sn and Cu-Sn SLID seal rings were mechanically characterized with shear and tensile tests. The evolution of bond microstructures and consequent effects on mechanical reliability were evaluated with a mixed flow gas test, a high temperature storage test and a thermal shock (TS) test. Virgin samples showed high mechanical strength. The Au-Sn system, with a thin Ni layer between the TiW adhesion layer and the bond, demonstrated a shear strength of 170 MPa. Cu-Sn, with a Cu-Cu3Sn-Cu structure, exhibited a shear strength of 275 MPa. Statistically significant decreases in strength were identified after reliability tests. The shear strength of the Au-Sn bond with an (AuSn + Au5Sn)eut structure decreased 40% in a corrosive environment. After 3000 TS cycles, the tensile strength of the Cu-Sn bond reduced by 45%. Fracture surface analysis revealed through-bond failures that were not observed previously. In cross-sectional analysis, vertical cracks were observed, which may contribute to the decrease in tensile strength.

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Authors and Affiliations

  1. Department of Electrical Engineering and Automation, School of Electrical Engineering, Aalto University, P.O. Box 13500, 00076, Aalto, Finland

    Antti Rautiainen, Hongbo Xu, Elmeri Österlund, Jue Li, Vesa Vuorinen & Mervi Paulasto-Kröckel

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  1. Antti Rautiainen
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  2. Hongbo Xu
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  3. Elmeri Österlund
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  4. Jue Li
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  5. Vesa Vuorinen
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  6. Mervi Paulasto-Kröckel
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Correspondence to Antti Rautiainen.

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Rautiainen, A., Xu, H., Österlund, E. et al. Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation. J. Electron. Mater. 44, 4533–4548 (2015). https://doi.org/10.1007/s11664-015-3929-8

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  • DOI: https://doi.org/10.1007/s11664-015-3929-8

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