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Low-temperature lead-free SnBiIn solder for electronic packaging

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Abstract

In pursuit of functionality and miniaturization in electronics, 3D integrated packaging requires low-temperature solders. This study explores a novel low-temperature lead-free SnBiIn solder. The solder has an ultimate tensile strength of 43.9 MPa, an elongation after break of 36.5%, and a low melting point of 91.8 °C. It is environmentally friendly with a homogeneous structure. Under controlled conditions of reflow at 150 °C for 5 min, the solder exhibited a solder/Cu(substrate) wetting angle of 32.6° and an average intermetallic compound (IMC) thickness of 2.3 μm—both meeting rigorous electronic industry standards. Furthermore, the Cu/SnBiIn/Cu joint demonstrated a substantial shear strength of 34.4 ± 1 MPa. These results highlight the potential of this lead-free, low-temperature solder for electronic packaging applications.

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Data availability

The data that support the findings of this study are available from the corresponding author upon reasonable request.

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Funding

This work was supported by Science and Technology Innovation 2025 Major Project of Ningbo (Grant No. 2022Z103).

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Authors and Affiliations

  1. State Key Laboratory of Advanced Brazing Filler Metals and Technology of Zhengzhou, Research Institute of Mechanical Engineering Co., Ltd., Zhengzhou, 450001, China

    Shannan Zhang, Weimin Long, Peiyan Li, Fuli Liu, Hangyan Xue & Tianran Ding

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  1. Shannan Zhang
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  2. Weimin Long
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  3. Peiyan Li
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  4. Fuli Liu
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  5. Hangyan Xue
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Contributions

All authors contributed to the study conception and design. SZ: Formal Analysis, Writing—Original Draft, Investigation. WL: Resources, Methodology. PL: Investigation, Validation. FL: Supervision, Validation. HX: Methodology, Funding Acquisition. TD: Data Curation, Writing—Review & Editing. All authors commented on previous versions of the manuscript. All authors read and approved the final manuscript.

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Correspondence to Tianran Ding.

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Zhang, S., Long, W., Li, P. et al. Low-temperature lead-free SnBiIn solder for electronic packaging. J Mater Sci: Mater Electron 35, 690 (2024). https://doi.org/10.1007/s10854-024-12405-x

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