Abstract
The purpose of the present work is to compare the structural and optical properties of the Silicon dioxide films obtained from TMOS Si(OCH3)4), N2O, and NH3 as precursor gases, which with respect to their potential optical applications, have been deposited by using inductively coupled plasma-enhanced chemical-vapor deposition method. The optical property as well as the thickness of the films were analyzed by means of variable angle spectroscopic ellipsometry. Morphological studies were carried out by scanning electron microscopy, and chemical composition characterization was performed with the help of energy dispersive spectroscopy unit coupled with the electron microscope. The type of the substance and the precursor composition used for silicon dioxide synthesis are effective on the chemical composition of the films. The refractive index values of these films advocate their use as high refractive index materials while their low extinction coefficients assure the devices transparency. The work presents deposition rates as well as the films optical properties, chemical composition and morphology regarding the operational parameters of their synthesis. It also provides a comparison of the characteristics of the two competitive precursor compounds.
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-015-3867-5/MediaObjects/10854_2015_3867_Fig1_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-015-3867-5/MediaObjects/10854_2015_3867_Fig2_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-015-3867-5/MediaObjects/10854_2015_3867_Fig3_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-015-3867-5/MediaObjects/10854_2015_3867_Fig4_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-015-3867-5/MediaObjects/10854_2015_3867_Fig5_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-015-3867-5/MediaObjects/10854_2015_3867_Fig6_HTML.gif)
Similar content being viewed by others
References
Y. Ma, G. Lucovsky, Deposition of single phase, homogeneous silicon oxynitride by remote plasma-enhanced chemical vapor deposition, and electrical evaluation in metal–insulator–semiconductor devices. J Vac. Sci. Technol. 12, 250–257 (1994)
K.E. Mattsson, Plasma-enhanced growth, composition, and refractive index of silicon oxy-nitride films. J. Appl. Phys. 17, 66–76 (1995)
M.N.P. Carreno, M.I. Alayo, I. Pereyra, A.T. Lopes, Fabrication of silicon microtips with integrated electrodes. Sens. Actuator A 10, 29–35 (2002)
S.C. Deshmukh, E.S. Aydil, Detection of combinative infrared absorption bands in thin silicon dioxide films. J. Vac. Sci. Technol., A 13, 23–35 (1995)
M. Ribeiro, I. Pereyra, M.I. Alayo, SiO2 electret thin films prepared by various deposition methods. Thin Solid Films 42, 200–209 (2003)
W.L. Scopel, R.R. Cuzinatto, M.H. Tabaniks, M.C. Fantini, M.I. Alayo, I. Pereyra, Chemical and morphological properties of amorphous silicon oxynitride films deposited by plasma enhanced chemical vapor deposition. J. Non-Cryst. Solids 22, 88–98 (2001)
M. Modreanu, M. Gartner, N. Tomozeiu, J. Seekamp, P. Cosmin, Investigation on optical and microstructural properties of photoluminescent LPCVD SiOxNy thin films. Opt. Mater. 17, 145–154 (2001)
S. Croci, A. Pecheur, J.L. Autran, A. Vedda, F. Caccavale, M. Martini, G. Spinilo, SiO2 films deposited on silicon at low temperature by plasma-enhanced decomposition of hexamethyldisilazane: defect characterization. J. Vac. Sci. Technol., A 19, 26–36 (2001)
Y. Inoue, O. Takai, A new method for obtaining the trap parameters of complex thermoluminescence glow peaks. J. Phys. D Appl. Phys. 5, 33–39 (1996)
R. Mota, D. Galvao, S.F. Durrant, M. Moraes, S. Dantas, M. Cantao, Initial stages in the formation of PtSi on Si(111) as followed by photoemission and spectroscopic ellipsometry. Thin Solid Films 27, 109–118 (1995)
S.B. Bang, T.H. Chung, Y. Kim, Plasma enhanced chemical vapor deposition of silicon oxide films using TMOS/O2 gas and plasma diagnostics. Thin Solid Films 12, 125–136 (2003)
M. Kannan, C.S. Yang, C.K. Choi, Electrical and optical properties of nitrogen-incorporated silicon-oxide. Films by using plasma-enhanced chemical-vapor deposition with tetramethoxysilane/N2O/NH3 gas. J. Korean Phys. Soc. 45, 94–108 (2005)
A.D. Nara, H. Itoh, Chemical-vapor deposition of OH-free and low-k organic-silica films. Jpn. J. Appl. Phys. 36, 147–158 (1997)
D.V. Tsu, G. Lucovsky, M.J. Mantini, Preparation of a-Si1-xNx: H film using N2 microwave afterglow chemical vapor deposition method. Plasma-assisted chemical vapor deposited silicon oxynitride. J. Vac. Sci. Technol. 5, 198–207 (1999)
M. Klanisek Gunde, M. Macek, FTIR and XPS investigations of a-SiOxNy thin films structure. Phys. Status Solidi 18, 430–439 (2001)
F. Hammelman, A. Aschentrup, A. Brechling, U. Heinzman, A. Gushterov, A. Szekeres, S. Simeonov, Plasma assisted deposition of thin silicon oxide in a remote PECVD reactor and characterization of films produced under different conditions. Vacuum 75(4), 307–319 (2004)
L. Torrison, J. Tolle, J. Kouvetakis, S.K. Dey, D. Gu, Plasma enhanced chemical vapor deposition of nitrogen. J. Non-Cryst. Solids 28, 80–88 (2001)
A. Mitsuo, T. Aizawa, Pacvd hard coatings for industrial applications. Mattrans 40, 12–23 (2009)
M.I. Alayo, I. Pereyra, W.L. Scopel, M.C.A. Fantini, On the nitrogen and oxygen incorporation in plasma-enhanced chemical vapor deposition (PECVD) SiOxNy films. Thin Solid Films 40, 154–169 (2002)
J.H. Lee, C.H. Jeong, J.T. Lim, N.G. Jo, S.J. Kyung, G.Y. Yeom, Characteristics of SiOx thin films deposited by using direct-type pin-to-plate dielectric barrier discharge with PDMS/He/O2 gases at low temperature. J. Korean Phys. Soc. 46, 89–101 (2005)
J.A. Theil, J.G. Brace, R.W. Knoll, J. Vac. Sci. Technol 12, 136–145 (1994)
M.S. Kang, Y. Kim, T.H. Chung, Proceedings of international COE forum on plasma science and technology, vol 34, pp. 195–206 (2005)
C. Vallee, A. Granier, K. Aumaille, C. Cardinaud, A. Goullet, N. Coulon, G. Turban, Appl. Surf. Sci. 138–139, 57–68 (1999)
C. Vallee, A. Goullet, F. Nicolazo, A. Granier, G. Turban, J. Non Cryst. Solids 21, 48–64 (1997)
A. Goullet, C. Vallee, A. Granier, G. Turban, J. Vac. Sci. Technol. 18, 245–253 (2000)
A. Grill, V. Patel, J. Appl. Phys. 85, 33–34 (1999)
C. Rau, W. Kulish, Thin Solid Films 24, 29–38 (1994)
Y. Inoue, H. Sugimura, O. Takai, Thin Solid Films 38, 52–64 (2001)
H. Ono, T. Ikarashi, Y. Miura, E. Hasegawa, K. Ando, T. Kitano, Appl. Phys. 74, 203–213 (1999)
Y.B. Park, S.W. Rhee, J. Appl. Phys. 86, 134–146 (1999)
H.U. Kim, S.W. Rhee, J. Mater. Sci.: Mater. Electron. 11, 579–592 (2000)
E.H. Nicollian, J.R. Brews, MOS Phys. Technol. 32, 321–335 (1982)
C. Yi, S.W. Rhee, J. Vac. Sci. Technol. 20, 398–409 (2002)
S.B. Bang, T.H. Chung, Y. Kim, M.S. Kang, J.K. Kim, J. Phys. D Appl. Phys. 37, 167–179 (2004)
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Zarchi, M., Ahangarani, S. Optical and morphological properties of silicon dioxide thin films. J Mater Sci: Mater Electron 27, 1165–1170 (2016). https://doi.org/10.1007/s10854-015-3867-5
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-015-3867-5