Abstract
This work was focused on the influence of Ga on the thermal properties, microstructural evolution and interfacial morphology with aging treatment at 150 °C of low-silver Sn–0.5Ag–0.7Cu (SAC) lead-free solder. The melting temperature of the SAC–Ga solder was decreased owing to the low melting point element Ga and the formations of intermetallic compound (IMC) and growth at the interfaces of SAC/Cu and SAC–0.5Ga/Cu were studied for different aging time ranging from 0 to 720 h. The results indicated that for both solders, the thickness of the IMC increased with aging time prolonging. However, compared with the interface of SAC/Cu, the thickness of the interface of SAC–Ga/Cu was obviously suppressed and the growing speed was slowed down, which may be attributed to the decreased activity of copper atoms by Ga addition, so that the SAC–Ga solder showed relatively planar-like IMC instead of scallop-like at the interface.
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References
D.G. Kim, S.B. Jung, Interfacial reactions and growth kinetics for intermetallic compound layer between In-48Sn solder and bare Cu substrate[J]. J. Alloy. Compd 386(1), 151–156 (2005)
K.W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, C.A. Handwerker, Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys[J]. J. Electron. Mater 29(10), 1122–1136 (2000)
D.W. Henderson, T. Gosselin, A. Sarkhel, S.K. Kang, W.K. Choi, D.Y. Shih, C. Goldsmith, K.J. Puttlitz, Ag3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys[J]. J. Mater. Res 17(11), 2775–2778 (2002)
K.S. Kim, S.H. Huh, K. Suganuma, Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu[J]. Microelectron. Reliab 43(2), 259–267 (2003)
L. Zhang, K.N. Tu, Structure and properties of lead-free solders bearing micro and nano pariticles[J]. Mater Sci Eng R Rep 82, 1–32 (2014)
K.S. Kim, S.H. Huh, K. Suganuma, Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints[J]. J. Alloy. Compd 352(1), 226–236 (2003)
Y. Liu, F.L. Sun, X.M. Li, Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints[J]. J. Mater. Sci. Mater. Electron 25(6), 2627–2633 (2014)
N.A.A.M. Amin, D.A. Shnawah, S.M. Said, M.F.M. Sabri, H. Arof, Effect of Ag content and the minor alloying element Fe on the electrical resistivity of Sn–Ag–Cu solder alloy[J]. J. Alloy. Compd 599, 114–120 (2014)
D.X. Luo, S.B. Xue, Z.Q. Li, Effects of Ga addition on microstructure and properties of Sn–0.5 Ag–0.7 Cu solder[J]. J. Mater. Sci. Mater. Electron 25, 3566–3571 (2014)
A.A. El-Daly, A.M. El-Taher, T.R. Dalloul, Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder[J]. J. Alloy. Compd 587, 32–39 (2014)
F.X. Chen, W.H. Zhu, Edith S.W. Poh, X.W. Zhang, X.R. Zhang, The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni do** under different strain rates and temperatures[J]. J. Alloy. Compd 507(1), 215–224 (2010)
Y. Liu, F.L. Sun, Y. Liu, Characterization of interfacial IMCs in low-Ag Sn–Ag–xCu–Bi–Ni solder joints[J]. J. Mater. Sci.: Mater. Electron 24(1), 290–294 (2013)
S.W. Yoon, J.R. Soh, H.M. Lee, B.J. Lee, Thermodynamics-aided alloy design and evaluation of Pb-free solder, Sn-Bi-In-Zn system[J]. Acta Mater 45(3), 951–960 (1997)
K.I. Chen, K.L. Lin, The microstructures and mechanical properties of the Sn–Zn–Ag–Al–Ga solder alloys-the effect of Ag[J]. J. Electron. Mater 31(8), 861–867 (2002)
T.J. Anderson, I. Ansara, The Ga-Sn (gallium-tin) system[J]. J. Phase Equilib 13(2), 181–189 (1992)
A.A. El-Daly, A. Fawzy, S.F. Mansour, M.J. Younis, Thermal analysis and mechanical properties of Sn–1.0 Ag–0.5 Cu solder alloy after modification with SiC nano-sized particles[J]. J. Mater. Sci.: Mater. Electron 24(8), 2976–2988 (2013)
T.Y. Lee, W.J. Choi, K.N. Tu, J.W. Jang, S.M. Kuo, J.K. Lin, D.R. Frear, K. Zeng, J.K. Kivilahti, Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu[J]. J. Mater. Res 17(02), 291–301 (2002)
J.W. Yoon, C.B. Lee, S.B. Jung, Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment[J]. J. Electron. Mater 32(11), 1195–1202 (2003)
T. Laurila, V. Vuorinen, M. Paulasto-Krockel, Impurity and alloying effects on interfacial reaction layers in Pb-free soldering[J]. Mater Sci Eng R Rep 68(1–2), 1–38 (2010)
N.S. Liu, K.L. Lin, The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn–8.55Zn–0.5Ag–0.1 Al–xGa solders and Cu[J]. Scr. Mater 54(2), 219–224 (2006)
W.X. Chen, S.B. Xue, H. Wang, Wetting properties and interfacial microstructures of Sn–Zn–xGa solders on Cu substrate[J]. Mater. Des 31(4), 2196–2200 (2010)
P. Xue, S.B. Xue, Y.F. Shen, F. Long, H. Zhu, Mechanism of Reaction Between Nd and Ga in Sn-Zn-0.5 Ga-xNd Solder[J]. J. Electron. Mater 43(9), 3404–3410 (2014)
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Luo, Dx., Xue, Sb. & Liu, S. Investigation on the intermetallic compound layer growth of Sn–0.5Ag–0.7Cu–xGa/Cu solder joints during isothermal aging. J Mater Sci: Mater Electron 25, 5195–5200 (2014). https://doi.org/10.1007/s10854-014-2288-1
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DOI: https://doi.org/10.1007/s10854-014-2288-1