Abstract
Indium-gallium-zinc oxide (IGZO) thin films have attracted significant attention for application in thin-film transistors (TFTs) due to their specific characteristics, such as high mobility and transparency. The performance of a-IGZO TFTs with four different insulators (SiO2 Si3N4, Al2O3 and HfO2) is examined using a numerical simulator (Silvaco Atlas). It is found that the output performance is significantly enhanced with high relative permittivity of the insulator. HfO2 gives the best performance: lower threshold voltage 0.23 V and subthreshold 0.09 V dec−1, higher field-effect mobility 13.73 cm2 s−1 V−1 and on current (Ion) and Ion/Ioff ratio \(2.81 \times 10^{ - 6}\) A, \(5.06 \times 10^{12}\), respectively. Therefore, HfO2 gate showed high stability compared with other gate insulator materials.
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Mohamed Labed et al. would like to thank the University of Biskra for its support.
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Labed, M., Sengouga, N. Simulation of the influence of the gate dielectric on amorphous indium-gallium-zinc oxide thin-film transistor reliability. J Comput Electron 18, 509–518 (2019). https://doi.org/10.1007/s10825-019-01316-4
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DOI: https://doi.org/10.1007/s10825-019-01316-4