Abstract
A microchannel heat sink with microchannel cold frame was designed, fabricated and measured. It was composed of side plates, microchannel cold plates and top/bottom plate in a certain welding sequence. In order to achieve high heat transfer coefficient, a microchannel with overflow internal structure was designed in this paper. The heat transfer performance of the microchannel heat sink was simulated by ANSYS software. The key factors affecting the welding process of the microchannel heat sink were determined by experiments. The measurement results show that the appearance of the weld is well formed, and there are no obvious defects such as porosity, slag inclusions, corrosion and so on. The airtightness and heat dissipation capacity of the microchannel heat sink reach more than 15 atm for 30 min and 200 W/cm2, respectively.
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Bian, Y., Zhuang, S., Cai, M., Li, S., Tong, L., Wu, S. (2020). Design, Fabrication and Measurement of Heat Sink with Microchannel Cold Frame for Electronics Cooling. In: Duan , B., Umeda, K., Hwang, W. (eds) Proceedings of the Seventh Asia International Symposium on Mechatronics. Lecture Notes in Electrical Engineering, vol 589. Springer, Singapore. https://doi.org/10.1007/978-981-32-9441-7_44
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DOI: https://doi.org/10.1007/978-981-32-9441-7_44
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Publisher Name: Springer, Singapore
Print ISBN: 978-981-32-9440-0
Online ISBN: 978-981-32-9441-7
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