A High-Efficiency and Low-Cost Ground Source Heat Pump System Design for Cold-Climate Application

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Proceedings of the 5th International Conference on Building Energy and Environment (COBEE 2022)

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Abstract

With the growing trends of building decarbonization, electrified systems, e.g., Ground Source Heat Pump (GSHP) systems, have been attracting more attention than ever. One of the most significant barriers faced by GSHP systems is the high initial cost that limits the market volume from expanding, especially in the residential sector of the U.S. This study entails research work to develop a high-efficiency and low-cost GSHP system using vertical underground boreholes integrated with a dry fluid cooler for a typical single-family house. It is expected to provide an alternative option that leads to cost savings and increases GSHP’s market penetration in the U.S. The designed system model was established in the TRNSYS environment, and its feasibility, when deployed in a cold climate region, is verified after model calibration. The results show that the proposed heat pump system with the use of vertical boreholes and a dry fluid cooler, as well as the optimized control strategies to select when the vertical boreholes and/or the dry fluid cooler are used, is suitable for use in cold climate regions, and it can achieve similar or better efficiency for space heating compared to a conventional GSHP system at lower initial and/or operating costs.

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Acknowledgements

The authors would like to acknowledge the funding provided by the Yale Center for Business and the Environment through the 2019 Renewable Thermal Alliance (RTA) Seed Innovation Grant.

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Correspondence to Yao Yu .

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© 2023 The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.

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Hu, X., Yu, Y., Miao, R., Megri, A.C. (2023). A High-Efficiency and Low-Cost Ground Source Heat Pump System Design for Cold-Climate Application. In: Wang, L.L., et al. Proceedings of the 5th International Conference on Building Energy and Environment. COBEE 2022. Environmental Science and Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-19-9822-5_25

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  • DOI: https://doi.org/10.1007/978-981-19-9822-5_25

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-19-9821-8

  • Online ISBN: 978-981-19-9822-5

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