Abstract
In this chapter we present and discuss experimental results on electron transport in various forms of granular diamond. Diamond has drawn attention in physical research as a semiconductor with unique properties. We should mention its extremely high thermal conductivity, resistance against radiation, wide bandgap, high mobility for electrons and holes, mechanical hardness, and biocompatibility giving diamond-based devices a potential applicability in a wide range of fields from high-power and high-frequency electronics to biomedicine. Preparation of synthetic diamond by high-pressure and high-temperature techniques in the 1950s was a first step to wide utilization. In the 1980s the chemical vapor deposition (CVD) technique was elaborated for diamond technology (Nebel CE, Ristein J (eds), Thin-film diamond I, II: semiconductors and semimetals, vols 76, 77. Elsevier, Amsterdam, 2004). From the late 1990s, the nano-crystalline and ultra-nano-crystalline diamond (NCD, UNCD) with a controlled grain size in the nanometer (nm) range came into play (Gruen DM, Annu Rev Mater Sci 29:211–259, 1999). Because of the possibility to prepare large-area thin films on non-diamond substrates, application of NCD and UNCD became promising.
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Acknowledgments
Research presented in this chapter was supported by the Czech Science Foundation Contract No P204/10/0212. Dieter Gruen, Alexander Kromka, and Miloš Nesládek, are acknowledged for sample growth and supply. We thank Karel Hruška, Vlastimil Jurka, Halyna Kozak, Karel Melichar, Jiří Pangrác, Zdeňka Poláčková, Jiří Potměšil, and Lucie Prušáková for sample processing and Petr Bátrna and Jarmila Šidáková for technical assistance. Dobroslav Kindl, Jozef Krištofik, and Bohuslav Rezek contributed significantly to the experimental work described in this chapter.
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Hubík, P., Mareš, J.J. (2012). Electron Transport Studies of Disorder and Dimensionality in Nano-Crystalline Diamond. In: Šesták, J., Šimon, P. (eds) Thermal analysis of Micro, Nano- and Non-Crystalline Materials. Hot Topics in Thermal Analysis and Calorimetry, vol 9. Springer, Dordrecht. https://doi.org/10.1007/978-90-481-3150-1_17
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