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  1. Effect of electromigration on microstructure and properties of CeO2 nanopartical-reinforced Sn58Bi/Cu solder joints

    To mitigate the decrease in mechanical performance of Sn58Bi/Cu solder joints resulting from electromigration-induced damage. The CeO 2 nanoparticles...

    Weiming Chen, Keke Zhang, ... Nannan Wang in Scientific Reports
    Article Open access 08 July 2024
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