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Optimizing temperature gradient for rapid fabrication of Cu/Sn/Cu full intermetallic compounds joints via vacuum thermal compression bonding
This study employed an improved thermal compression bonding process with two temperature settings (180 °C/250 °C, 250 °C/250 °C) to rapidly fabricate...
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Antioxidative copper sinter bonding under thermal aging utilizing reduction of cuprous oxide nanoparticles by polyethylene glycol
Durability of sintered Cu joints under thermal aging in the air was investigated for the reduction of Cu 2 O using Cu 2 O/polyethylene glycol (PEG)...
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Laser Transmission Welding of Polypropylene: Insights into Parameter Interplay, Thermal Analysis, Bonding Quality, Fracture Characteristics, and Weld Morphology
Laser transmission welding (LTW), a versatile polymer joining process utilizing laser energy, and its application to polypropylene, a widely used...
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Ionic Bonding
Here we introduce the concept of ionic bonding, including electronegativity, the Madelung constant, lattice energy, the Born Haber cycle, and...
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Covalent, Metallic, and Secondary Bonding
This chapter introduces the concepts of bonding, coordination, and packing fraction. We start with covalent bonding, encompassing both valence bond...
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Thermal and Electrical Properties Depending on the Bonding Structure of Amorphous Carbon Thin Films
Efficient heat energy management during operation remains a critical challenge in Phase Change Memory (PCM) devices. Reducing the thermal...
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The Bonding Formation during Thermal Spraying of Ceramic Coatings: A Review
Thermal spraying is the most important coating technology for depositing advanced ceramic coatings which have been widely applied to different...
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Indium thermal interface material microstructure as a function of thermal history and bonding metallization
Indium has gained attention as a thermal interface material (TIM), in high-power electronics, due to its high thermal conductivity and mechanical...
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Hydrogen bonding and π-π interaction enhanced high thermal interface design with low dielectric loss of BN/PI/epoxy for high voltage-high frequency insulating application
The formation of thermally conductive pathway is the key to improve thermal conductivity (TC), and the interface design of filler/polymer is the key...
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Effect of Die Deflection during Au Wire Bonding Process on Bonding Quality in Overhang Semiconductor Package
Wire bonding is an interconnection technique widely used in semiconductor packaging. Certain packages employ a stacked die configuration for...
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Fabricated Metal Laminates via Cold Roll Bonding Techniques
Different from the hot roll bonding technique, cold roll bonding is completed at room temperature. Moreover, more than 60% reduction in the first...
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Interfacial Bonding Characteristics in Natural Fiber Reinforced Polymer Composites Fiber-matrix Interface In Biocomposites
This book provides a general overview of the importance of fibre-matrix interfacial bonding characteristics in natural fibre-based composites to...
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Copper Bonding Technology in Heterogeneous Integration
As semiconductor device scaling faces a severe technical bottleneck, vertical die stacking technologies have been developed to obtain high...
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Joining performance and thermal mechanism of stainless steel/GFRP bonding joints via single-side resistance spot welding process
As an important way of lightweight, the hybrid structure of metal and plastic has a good application prospect in the automotive field. However,...
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Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder
With the increasing miniaturization and power of optoelectronic devices, direct bonding of optical substrates like semiconductors and ceramics to...
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Introduction—Interfaces in Adhesion and Adhesive Bonding
The social background of research on adhesion and adhesive bonding is reviewed. Next, the interphase in the adhesive bond is defined, and the...
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Fabricated Metal Laminates via Hot Roll Bonding Techniques
The hot roll bonding technique of metal laminates initially appeared in the 1940s, which is usually applied in the fabrication of thick plate. The...
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Thermal Shock Resistance and Bonding Strength of Novel-Structured Thermal Barrier Coatings with Different Microstructure
Structural tailoring is an effective method for improving the performance of thermal barrier coatings. In this study, embedded micro-agglomerated...
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Pressure-assisted direct bonding of copper to silicon nitride for high thermal conductivity and strong interfacial bonding strength
To achieve superior thermal and mechanical properties of copper-bonded (Cu-bonded) Si 3 N 4 substrate, a pressure-assisted direct bonded Cu (DBC)...
