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Showing 1-20 of 3,101 results
  1. Effects of diamond particle size on microstructure and properties of diamond/Al-12Si composites prepared by vacuum-assisted pressure infiltration

    Diamond/aluminium composites have attracted attention in the field of thermal management of electronic packaging for their excellent properties. In...

    Jia-** Fu, Can-xu Zhou, ... Yuan Liu in China Foundry
    Article 20 May 2024
  2. Semiconductor Lasers

    This article discusses the basic operation principle, material engineering aspects, and different architectures for the design of semiconductor...
    Martin R. Hofmann, Stephan W. Koch in Springer Handbook of Semiconductor Devices
    Chapter 2023
  3. Diamond-Based Detectors of Ionizing Radiation

    Abstract

    In this paper, we present the results of experiments on studying the phenomena of polarization and the efficiency of charge collection in the...

    A. A. Altukhov in Russian Microelectronics
    Article 01 June 2023
  4. A Short Review on Diamond Reinforced Aluminium Composites

    Diamond, which is a type of carbon material, is an attractive reinforcement material for aluminium matrix composites due to its excellent properties...
    Nur Izzah Nazurah Kusuadi, Nur Ayuni Jamal, Yusilawati Ahmad in Proceeding of 5th International Conference on Advances in Manufacturing and Materials Engineering
    Conference paper 2023
  5. Sol–gel polishing technology for extremely hard semiconductor substrates

    Extremely hard semiconductor substrates, including sapphire, SiC, and diamond, have been widely used in the semiconductor field in recent decades....

    Article 15 February 2022
  6. An encoder-decoder-based image segmentation method for abrasive height detection of diamond wire

    The diamond wire (DW) is widely used in the field of slicing semiconductor materials such as monocrystalline silicon and polycrystalline silicon. The...

    Yukang Zhao, Peiqi Ge, ... **tao Zheng in The International Journal of Advanced Manufacturing Technology
    Article 01 June 2024
  7. Assessment of sustainable and machinable performance metrics of monocrystalline silicon carbide wafer with electrophoretic-assisted multi-diamond wire sawing

    The rapacious demand for energy in semiconductor wafer manufacturing industries has significant implications for global warming and wafer...

    Eyob Messele Sefene, Chao-Chang Arthur Chen, ... Ding-Xuan Huang in The International Journal of Advanced Manufacturing Technology
    Article 19 May 2024
  8. Machining accuracy and force characteristic of diamond wire sawing and diamond wire electrical discharge sawing during rip sawing and cross sawing

    Diamond wire sawing (DWS) is often used to cut and slice crystalline silicon. The machining accuracy of DWS is a key performance of wire sawing....

    Article 03 March 2023
  9. Basic Concepts of the Semiconductor Physics

    In this chapter, we present some of the main physical properties of the semiconductor materials, such as the materials are classified in terms of...
    Salvador Pinillos Gimenez, Egon Henrique Salerno Galembeck in Differentiated Layout Styles for MOSFETs
    Chapter 2023
  10. Magnetic-field-assisted abrasive sensing and its deployment in electroplated diamond cutting wires

    This paper discusses the manufacturing process of magnetic-field-assisted abrasive sensing for electroplated diamond cutting wires. The study uses a...

    Article 26 September 2023
  11. 1.10 Basics of Semiconductor Technology

    How semiconductor (discrete and integrated electronic) components are made is of interest not only to satisfy the curiosity of the reader but also to...
    Chapter 2023
  12. A study on the development of sub-micron single-crystal diamond tools for machining diffractive optical elements

    Machining fine patterns of hundreds of nanometers requires the use of 5-axis equipment and fine tools with precise control. In this study, the...

    Seok-Jae Ha, Seon-Jhin Yoon, ... Sung-Taek Jung in The International Journal of Advanced Manufacturing Technology
    Article 18 April 2023
  13. Machine vision online detection for abrasive protrusion height on the surface of electroplated diamond wire saw

    Electroplated diamond wire saw is the main tool for slicing semiconductor materials such as silicon. The quality and efficiency of slicing would be...

    Yukang Zhao, Peiqi Ge, ... Jialei Lan in The International Journal of Advanced Manufacturing Technology
    Article 05 August 2022
  14. Fabrication of the optical lens on single-crystal germanium surfaces using the laser-assisted diamond turning

    Single-crystal germanium, as an excellent infrared optical material, has been widely applied in X-ray monochromators, night vision systems, and gamma...

    Article Open access 25 April 2024
  15. Analytical investigation of thermodynamic properties of power electronic semiconductor materials

    Theoretical and experimental investigations are critical for accurately investigating the structure and physical properties of semiconductors,...

    Zafer Dogan, Tural Mehmetoglu in Journal of Computational Electronics
    Article 19 May 2024
  16. A revision of the semiconductor theory from history to applications

    Semiconductors play a crucial role in modern technology across various fields. The term “semiconductor” was introduced in the XVIII century, marking...

    Catarina P. Correia V. Bernardo, Ricardo A. Marques Lameirinhas, ... João Paulo N. Torres in Discover Applied Sciences
    Article Open access 08 June 2024
  17. Investigation on focused ultrasound-assisted diamond wire sawing of silicon carbide

    Focused ultrasound-assisted diamond wire sawing (DWS) is proposed in order to improve the sawing performance in terms of sawing force, surface...

    Lutao Yan, **uhong Chen, ... Qinjian Zhang in The International Journal of Advanced Manufacturing Technology
    Article 17 August 2023
  18. Scheming of Diamond Ring Harvestor for Low-Powered IoT Devices

    With the advent of new technologies, storing and securing digital energy is becoming a keen aspect of research. This paper focuses on designing and...
    Conference paper 2023
  19. Characterization and dressing effect of CMP diamond disc conditioner with ordered abrasive distribution

    With the advent of the 5G information age, the production and processing of computer chips have attracted people’s attention. In order to adapt to...

    Zhaozhi Guo, Songhao Yang, ... Jun Cheng in The International Journal of Advanced Manufacturing Technology
    Article 24 July 2023
  20. Gallium Nitride Semiconductor Devices

    This chapter introduces the Gallium Nitride semiconductor devices to the readers. Starting from the end application point of view, this chapter first...
    Chapter 2022
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