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Implantable Device Fabrication and Packaging
Neural implants are developed with regard to the general aspects of active implant design, packaging philosophies, and decisions on manufacturing...
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3D-Opto-MID Coupling Concept Using Printed Waveguides
The central question for Chap. 6 is how to connect optical multimode waveguides without interruption. Such systems are needed in device communication...
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State of the Art
The discourse in this dissertation aims to provide a working solution to creating three-dimensional electronic devices by combining the additive...
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Fan-Out Technology
There are eight different topics in this chapter. (1) chip-first with die face-down for heterogeneous integration of 4 chips and 4 capacitors, (2)...
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Implantable Device Fabrication and Packaging
Neural implants are developed with regard to the general aspects of active implant design, packaging philosophies, and decisions on manufacturing...
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Current Development in the Field of Optical Short-Range Interconnects
The current development in the field of information and data transmission is driven by a constantly growing amount of data generated worldwide....
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Chiplets Lateral Communications
As mentioned in Chap. 2.5 , the key disadvantages of chipletChiplet design and heterogeneous...
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Fabrication of Parts with Integrated Circuits by Selective Electroless Plating of Additively Manufactured Plastic Substrates
The use of printed circuit boards (PCBs) has become essential in manufacturing parts with electronic functions. However, the placement of PCBs inside...
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Introduction
Look at the stars and you can perceive that the world is changing. Star-like lights streak through the night sky in a straight line, part of...
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Multiple System and Heterogeneous Integration with TSV-Less Interposers
In this chapterTSV-less interposer, the recent advances in multiple systemMultiple system and heterogeneous integrationHeterogeneous integration with...
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High-frequency induction heating for increase of flow length in polymer/metal hybrid molding
Recent trends of miniaturization and multi-functionality in electrical parts have driven development of molded interconnect devices (MIDs) that...
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Experimental measurement and modeling of film thickness distribution in film insert injection molding process
In this study, the effect of flow rate and melt temperature on the film thickness during the film insert injection molding (FIM) process is...
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Materials for Hardware Security
Hardware security for integrated circuits (ICs) is becoming an increasingly relevant issue for semiconductor devices, and physical inspection methods...
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MEMS Package Design and Technology
The chapter describes the main challenges of package design and how technology bricks are set together and linked to fabricate effective sensor...
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In-Mold Electronics on Poly(Lactic Acid): towards a more sustainable mass production of plastronic devices
3D Plastronics is a technology capable of improving the integration of heterogeneous functions in or on polymer packages of electronic devices by...
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Overview of Packaging Technologies and Cooling Solutions in ADAS Market
Automotive electronics is among the fastest growing segments of semi-conductor industry (...
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Experimental development of the AMMID process
This chapter describes the experimental development of a new process chain for the manufacture of MID based on the SLS process, called the additive...
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Multiple System and Heterogeneous Integration with TSV-Interposers
As mentioned in Chaps. 1 and 2 and Lau in IEEE Trans CPMT 12:1271–1281...
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Degradation and Remaining Useful Life Prediction of Automotive Electronics
Reliability of electronics is a major issue for today’s society. Highly automated and autonomous systems exist in every aspect of our life, from...
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Numerical and experimental study on protective film removal towards the automation of flexible electronics assembly
Flexible electronics is one of the most promising trends in the electronics industry, with increasing implementations in several application fields....
