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Article
Formulation and characterization of anisotropic conductive adhesive paste for microelectronics packaging applications
There has been a steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. In this paper, several anisotropic conductive adhesive (ACA) ...
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Article
Electrical characterization of isotropic conductive adhesive under mechanical loading
Isotropic conductive adhesive (ICA) is a strong candidate for replacing toxic lead-based solders. Before wide application of this new technology can occur, the degradation mechanisms must be thoroughly underst...
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Article
Ternary alloying study of MoSi2
Ternary alloying of MoSi2 with adding a series of transition elements was investigated by X-ray diffraction (XRD), scanning electron microscopy, transmission electron microscopy (TEM), and energy dispersive spect...