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  1. No Access

    Article

    Formulation and characterization of anisotropic conductive adhesive paste for microelectronics packaging applications

    There has been a steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. In this paper, several anisotropic conductive adhesive (ACA) ...

    Liqiang Cao, Shiming Li, Zonghe Lai, Johan Liu in Journal of Electronic Materials (2005)

  2. No Access

    Article

    Electrical characterization of isotropic conductive adhesive under mechanical loading

    Isotropic conductive adhesive (ICA) is a strong candidate for replacing toxic lead-based solders. Before wide application of this new technology can occur, the degradation mechanisms must be thoroughly underst...

    Zhimin Mo, **tao Wang, Tiebing Wang, Shiming Li… in Journal of Electronic Materials (2002)