Skip to main content

1 Result(s)

within Yuzhu Han Remove this filter Materials Science Remove this filter English Remove this filter

and

  1. No Access

    Article

    Effects of solder thickness on interface behavior and nanoindentation characteristics in Cu/Sn/Cu microbumps

    The thickness of the solder, for Cu/Sn/Cu microbumps with dimensions of tens of microns or even a few microns (such as 40 µm, 15 µm, 10 µm, and 6 µm), can have a significant effect on the interfacial transfer ...

    Zhiyuan Zhang, Jieshi Chen, Jianing Wang, Yuzhu Han, Zhiyuan Yu… in Welding in the World (2022)