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    Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board

    The growth of IMCs at solder/substrate interface becomes more important with the sustaining advancement of integrated circuit technology. The purpose of this study was to investigate the morphology and growth ...

    Yuanming Chen, Lingzhi Zhang, Jiaying Xu… in Journal of Materials Science: Materials in… (2021)