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  1. No Access

    Article

    The Effect of Thermal Aging on the Mechanical Properties of Gold-Containing Solder Joints

    The reliability of SnPbAg solder joints containing gold (Au) under different aging conditions have been investigated. The solder joints were prepared by printing Sn62Pn36Ag2 solder paste on gold-plated copper ...

    Yinghao Bi, Weiqi Guo, Shaobin Wang, Weiwei Zhang… in Journal of Electronic Materials (2024)

  2. No Access

    Article

    Effects of GNSs addition on the electromigration of Sn58Bi and Cu-core Sn58Bi joint

    Graphene nanosheets (GNSs) modified Sn58Bi and Cu-core Sn58Bi solder joints were manufactured in this work. The evolution of microstructure and growth of intermetallic compounds (IMCs) under current stressing ...

    Peng Liu, Weiqi Guo, ** Wu in Journal of Materials Science (2022)