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    Interfacial reaction and solder joint reliability of Pb-free solders in lead frame chip scale packages (LF-CSP)

    Chip scale packages (CSP) have essential solder joint quality problems, and a board level reliability is a key issue in design and development of the CSP type packages. There has been an effort to eliminate Pb...

    Seung Wook Yoon, Chang Jun Park, Sung Hak Hong… in Journal of Electronic Materials (2000)