Skip to main content

1 Result(s)

within Shinya Takyu Remove this filter Materials Science Remove this filter Applied and Technical Physics Remove this filter Characterization and Evaluation of Materials Remove this filter Materials Engineering Remove this filter Materials Science, general Remove this filter

and

  1. No Access

    Article

    Novel Wafer Dicing and Chip Thinning Technologies Realizing High Chip Strength

    As telecommunication equipment that supports high-level information networks is being made portable, the requirements for telecommunication equipment to be small and lightweight are becoming stricter. Thus, mi...

    Shinya Takyu, Tetsuya Kurosawa, Noriko Shimizu… in MRS Online Proceedings Library (2011)