Page
%P
![Loading...](https://link.springer.com/static/c4a417b97a76cc2980e3c25e2271af3129e08bbe/images/pdf-preview/spacer.gif)
-
Article
New Photosensitive Polyimide (SIM2000XL-RTS) for Packaging Applications
Polyimides are finding increased use as dielectric materials in multi-level metallization technology, which is the key to high-density packaging applications for microelectronics.
-
Article
Crosslinking and Ciiain-Scission of Photosensitive Polyimidesiloxane Under Deep UV Irradiation
Polyimides are considered as promising packaging materials in multi-layer interconnections and multi-chip modules because of their low dielectric constant and good planarizability. Photosensitive polyimidesilo...