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  1. No Access

    Article

    Crosslinking and Ciiain-Scission of Photosensitive Polyimidesiloxane Under Deep UV Irradiation

    Polyimides are considered as promising packaging materials in multi-layer interconnections and multi-chip modules because of their low dielectric constant and good planarizability. Photosensitive polyimidesilo...

    S. Jeng, M. Xu, H. S. Kwok, D. Y. Tang, H. R. Acharya… in MRS Online Proceedings Library (1990)

  2. No Access

    Article

    New Photosensitive Polyimide (SIM2000XL-RTS) for Packaging Applications

    Polyimides are finding increased use as dielectric materials in multi-level metallization technology, which is the key to high-density packaging applications for microelectronics.

    S. Jeng, M. Xu, P. L. Liu, H. S. Kwok, C. J. Lee in MRS Online Proceedings Library (1989)