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Article
Crosslinking and Ciiain-Scission of Photosensitive Polyimidesiloxane Under Deep UV Irradiation
Polyimides are considered as promising packaging materials in multi-layer interconnections and multi-chip modules because of their low dielectric constant and good planarizability. Photosensitive polyimidesilo...
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Article
New Photosensitive Polyimide (SIM2000XL-RTS) for Packaging Applications
Polyimides are finding increased use as dielectric materials in multi-level metallization technology, which is the key to high-density packaging applications for microelectronics.