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  1. Article

    Open Access

    Finite element analysis (FEA) modelling and experimental verification to optimise flexible electronic packaging for e-textiles

    In this paper a three-dimensional model of a novel electronic package has been developed using Finite element analysis to evaluate the shear load, tensile, bending and thermal stresses. Simulations of a comple...

    Menglong Li, Russel Torah, **gqi Liu, John Tudor, Steve Beeby in Microsystem Technologies (2022)

  2. Article

    Open Access

    Modified PDMS packaging of sensory e-textile circuit microsystems for improved robustness with washing

    Electronic Textiles (e-textiles) should ideally be handled and cleaned like traditional textiles. Therefore, we can expect e-textiles to be machine washed or hand washed. As e-textiles enhance traditional fabr...

    Olivia Ojuroye, Russel Torah, Steve Beeby in Microsystem Technologies (2022)

  3. Article

    Open Access

    Automated insertion of package dies onto wire and into a textile yarn sheath

    Wider adoption of electronic textiles requires integration of small electronic components into textile fabrics, without comprising the textile qualities. A solution is to create a flexible yarn that incorporat...

    Dorothy Anne Hardy, Ioannis Anastasopoulos, Mohamad-Nour Nashed in Microsystem Technologies (2022)