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Article
Open AccessFinite element analysis (FEA) modelling and experimental verification to optimise flexible electronic packaging for e-textiles
In this paper a three-dimensional model of a novel electronic package has been developed using Finite element analysis to evaluate the shear load, tensile, bending and thermal stresses. Simulations of a comple...
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Article
Open AccessModified PDMS packaging of sensory e-textile circuit microsystems for improved robustness with washing
Electronic Textiles (e-textiles) should ideally be handled and cleaned like traditional textiles. Therefore, we can expect e-textiles to be machine washed or hand washed. As e-textiles enhance traditional fabr...
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Article
Open AccessAutomated insertion of package dies onto wire and into a textile yarn sheath
Wider adoption of electronic textiles requires integration of small electronic components into textile fabrics, without comprising the textile qualities. A solution is to create a flexible yarn that incorporat...