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    Chapter

    Nonlinear Analysis of a Ceramic Pin Grid Array (PGA) Soldered to an Orthotropic Epoxy Substrate

    The pin grid array (PGA) is one form of first-level package.1–4 It has had a predominant role in high-density packaging for many years and is commonly used in high-performance computers. The advantages of the PGA...

    John Lau, Ravi Subrahmanyan, Steve Erasmus in Thermal Stress and Strain in Microelectron… (1993)