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Open AccessExperimental and Thermodynamic Assessment of the Nb-Ni-Y System
Phase equilibria in the ternary Nb-Ni-Y system are studied experimentally for the first time using x-ray diffraction, electron probe microanalysis, and differential scanning calorimetry in combination with lev...
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Advanced Barriers for Copper Interconnects
Both Ta-Si-N and W-Si-N films have promising properties as diffusion barriers for copper metallization. For Ta-Si-N films with a silicon content of ∼ 20 at%, as an optimised system regarding thermal stability ...