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Mei-Hsin Lo
Materials Science
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Article
Effect of expelling P content on Ni(P) dissolution and reaction with SnAgCu(Ni)
The present work studied the crystallinity effecting of Ni(P) layer on the interfacial reaction between SAC1205-0.05Ni solder and electroless-Ni(P)/electroless-Pd(P)/immersion-Au (ENEPIG) surface finish. By TE...
