Page
%P
![Loading...](https://link.springer.com/static/c4a417b97a76cc2980e3c25e2271af3129e08bbe/images/pdf-preview/spacer.gif)
-
Article
Microstructure Evolution During Transient Liquid Phase Bonding of Alloy 617
Transient liquid phase bonding was used to join Alloy 617 alloy using nickel-based filler metal (Ni–P 11 wt%) with P as the melting point depressant element. The influences of interlayer thickness, 25.4 and 38...