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  1. No Access

    Article

    Investigation of Ga do** for non-stoichiometric sodium bismuth titanate ceramics

    The electrical properties of Ga3+ do** Na0.5Bi0.5TiO3-based oxygen ionic conductors were studied. The Na0.52Bi0.47Ti1−xGaxO3−δ (x = 0, 0.01, 0.015, 0.02) samples were fabricated by the means of traditional soli...

    M. Y. Li, C. He, W. G. Wang, G. L. Hao… in Journal of Materials Science: Materials in… (2021)

  2. No Access

    Article

    Investigation of Sr, Mg codoped Na0.5Bi0.5TiO3 oxide ion conductor prepared by spark plasma sintering

    The spark plasma sintering and conventional sintering methods were used to prepare the Sr/Mg–codoped Na0.5Bi0.48Sr0.02Ti0.96Mg0.04O2.95 (NBT-SM) compounds. By the AC impedance spectrum test, the grain and total c...

    W. G. Wang, M. Y. Li, X. Y. Li, G. L. Hao in Ionics (2019)

  3. No Access

    Article

    Hexagonal-Rod Growth Mechanism and Kinetics of the Primary Cu6Sn5 Phase in Liquid Sn-Based Solder

    A hexagonal-rod growth mechanism is proposed to describe the growth behavior of the primary Cu6Sn5 phase in liquid Sn-based solder. After Sn-6.5 at.%Cu solder had been maintained at 250°C for 10 h, a large number...

    Z. H. Zhang, H. J. Cao, H. F. Yang, M. Y. Li, Y. X. Yu in Journal of Electronic Materials (2016)

  4. No Access

    Article

    Preparation and characterization of multiferroic CoFe2O4/Bi0.97Ce0.03FeO3 coaxial nanotubes

    Multiferroic CoFe2O4 (CFO)/Bi0.97Ce0.03FeO3 (BCFO) coaxial nanotubes were prepared by a sol-gel template method. Transmission electron microscopy revealed that the coaxial nanotubes featured with inner CFO and ou...

    X. L. Liu, M. Y. Li, J. Wang, Z. Q. Hu, Y. D. Zhu, X. Z. Zhao in Applied Physics A (2012)

  5. No Access

    Article

    Grain Orientation Evolution and Deformation Behaviors in Pb-Free Solder Interconnects Under Mechanical Stresses

    In this study, the effect of mechanical stresses on the recrystallization behavior of Sn-3.0Ag-0.5Cu Pb-free solder interconnects was studied by four-point cyclic bending, shear tests, and tensile tests. Scann...

    H.T. Chen, L. Wang, J. Han, M.Y. Li, Q.B. Wu, J.M. Kim in Journal of Electronic Materials (2011)

  6. Article

    Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging

    H.T. Chen, C.Q. Wang, C. Yan, M.Y. Li, Y. Huang in Journal of Electronic Materials (2007)

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  7. No Access

    Article

    Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging

    Interfacial reactions in Ni-SnAg-Cu and Au/Ni/Cu-SnAg-Cu solder joints were investigated to understand the coupling effect between different pads during soldering and thermal aging processes. Scanning electron...

    H.T. Chen, C.Q. Wang, C. Yan, M.Y. Li, Y. Huang in Journal of Electronic Materials (2007)

  8. No Access

    Article

    Matrix effect of bombardment-induced Gibbsian segregation on Cu depletion at a Cu x Ni100−x subsurface

    A dynamic Monte-Carlo program, including an improved BIGS (Bombardment-Induced Gibbsian Segregation) model was employed to study the matrix effect of BIGS and its influence on Cu depletion at the subsurface un...

    L. -P. Zheng, R. -S. Li, X. -Q. **a, M. -Q. Li, M. -Y. Li in Applied Physics A (1995)