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  1. No Access

    Article

    Hexagonal-Rod Growth Mechanism and Kinetics of the Primary Cu6Sn5 Phase in Liquid Sn-Based Solder

    A hexagonal-rod growth mechanism is proposed to describe the growth behavior of the primary Cu6Sn5 phase in liquid Sn-based solder. After Sn-6.5 at.%Cu solder had been maintained at 250°C for 10 h, a large number...

    Z. H. Zhang, H. J. Cao, H. F. Yang, M. Y. Li, Y. X. Yu in Journal of Electronic Materials (2016)

  2. No Access

    Article

    Grain Orientation Evolution and Deformation Behaviors in Pb-Free Solder Interconnects Under Mechanical Stresses

    In this study, the effect of mechanical stresses on the recrystallization behavior of Sn-3.0Ag-0.5Cu Pb-free solder interconnects was studied by four-point cyclic bending, shear tests, and tensile tests. Scann...

    H.T. Chen, L. Wang, J. Han, M.Y. Li, Q.B. Wu, J.M. Kim in Journal of Electronic Materials (2011)

  3. Article

    Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging

    H.T. Chen, C.Q. Wang, C. Yan, M.Y. Li, Y. Huang in Journal of Electronic Materials (2007)

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  4. No Access

    Article

    Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging

    Interfacial reactions in Ni-SnAg-Cu and Au/Ni/Cu-SnAg-Cu solder joints were investigated to understand the coupling effect between different pads during soldering and thermal aging processes. Scanning electron...

    H.T. Chen, C.Q. Wang, C. Yan, M.Y. Li, Y. Huang in Journal of Electronic Materials (2007)