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    Abnormal Cu Grain Growth by External Stress on Electroplated Cu Films

    In this study, the effect of external stress on the Cu microstructure evolution of electroplated Cu films was studied. We found that, with applying external compressive stress, abnormal grain growth occurred i...

    Jui-Sheng Chang, Chung-Yu Chiu, Yu-Chen Huang, Ting-Yi Cheng, Zhong-Yen Yu… in JOM (2024)