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    Effect of nano-TiO2 addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish

    The effects of nano-TiO2 particles on the interfacial microstructures and bonding strength of Sn3.5Ag0.5Cu composite solder joints in ball grid array packages with immersion Sn surface finishes have been investig...

    J. C. Leong, L. C. Tsao, C. J. Fang… in Journal of Materials Science: Materials in… (2011)