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    Article

    Magnetic Response of Hydrothermally Prepared Self-Assembled Co3O4 Nano-platelets

    In the present communication, we report a strong ferrimagnetic behavior of self-assembled Co3O4 nano-platelets, which most likely originates from the intrinsic spin structure of the unique Co3O4 structure. The mi...

    M.A. Dar, S.H. Nam, J.Y. Kim, I. Ahmad, B.K. Cho in Journal of Electronic Materials (2015)

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    Article

    The effects of electroplating parameters on the composition and morphology of Sn-Ag solder

    The Sn-Ag solder was electrodeposited from a bath that basically is composed of tin sulfate (SnSO4), silver nitrate (AgNO3), and thiourea (CH4N2S), acting as a complexing agent to silver. The composition and morp...

    J. Y. Kim, J. Yu, J. H. Lee, T. Y. Lee in Journal of Electronic Materials (2004)

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    Article

    Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint

    Pure Ni, the Ni-Cu alloy, and pure Cu layers as the under bump metallurgy (UBM) for a flip-chip solder joint were deposited by electrolytic plating. For the pure Ni layer, residual stress can be controlled by ...

    S. -H. Kim, J. -Y. Kim, J. Yu, T. Y. Lee in Journal of Electronic Materials (2004)

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    Article

    Effect of Bragg reflector on the threshold current density in AlGaInP visible laser

    The GalnP/AlGalnP layers are known as attractive materials for 600 nm band laser diodes. In this paper, a Bragg reflector between GaAs substrate and n-cladding layer was applied for the reduction in the lasing...

    M. S. Oh, N. H. Kim, C. H. Lee, H. S. Park, J. Y. Kim in Journal of Electronic Materials (1995)