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    Monte Carlo-Based Stochastic Finite Element Model for Electromigration in the Interfaces of SAC Solder and Cu Conductors with Uncertainties in Boundary Conditions

    The time-dependent progress of electromigration (EM) in the interfaces of Sn-Ag-Cu solder and Cu conductors is sensitive to the uncertainties in boundary conditions. A Monte Carlo-based stochastic finite eleme...

    Liu Chu, Jiajia Shi, Eduardo Souza de Cursi in Journal of Electronic Materials (2022)