12 Result(s)
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Article
Abnormal Cu Grain Growth by External Stress on Electroplated Cu Films
In this study, the effect of external stress on the Cu microstructure evolution of electroplated Cu films was studied. We found that, with applying external compressive stress, abnormal grain growth occurred i...
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Article
Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder
This study investigates the dissolution behavior of the Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe C19210 substrates in Sn-9 wt.%Zn solder (SZ) at temperatures of 240°C, 270°C, and 300°C for 5–100 min. The c...
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Article
Open AccessInterleaved step-down converter with capacitor-diode voltage splitter and minimum switches for low current ripple and extra-low voltage ratio
This paper proposes an interleaved step-down converter (ISDC) with a capacitor-diode voltage splitter. Even though the ISDC only utilizes two active switches, it can significantly step down a high input voltag...
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Article
Heterogeneous 3D Morphological Evolution of Ni Microparticles in Molten Salts: Visualized by Operando Synchrotron X-ray Nano-tomography
Ni-based superalloys are promising materials for high-temperature molten salt (MS) energy generation and storage. Studying morphological and chemical evolution of pure Ni in MS provides fundamental knowledge f...
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Article
Effects of Tempering Temperature on the Microstructure and Mechanical Properties of MIM-4605 High-Strength Low-Alloy Steel
This research focuses on the effects of different tempering temperatures (200°C, 300°C, 400°C, and 500°C) on the microstructure and mechanical properties of MIM-4605 steel. The results show that the matrix of ...
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Article
Leaching Behavior of Mixed Rare Earth Concentrates after Decomposition by Microwave Heating
The leaching behaviors of rare earth elements (REEs) in HCl solution have been investigated for mixed rare earth concentrates after decomposition by microwave heating. The effects of HCl concentration, tempera...
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Article
Formation of a Diffusion Barrier-Like Intermetallic Compound to Suppress the Formation of Micro-voids at the Sn-0.7Cu/Cu Interface by Optimal Ga Additions
Kirkendall micro-voids observed within ϵ-Cu3Sn or at the bulk Sn solder/Cu interface are undesirable imperfections in solder joints in electronic interconnections that significantly decrease the reliability of th...
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Article
A Critical Review on the Electromigration Effect, the Electroplastic Effect, and Perspectives on the Effects of Electric Current Upon Alloy Phase Stability
The electronic interconnections in the state-of-the-art integrated circuit manufacturing have been scaled down to the micron or sub-micron scale. This results in a dramatic increase in the current density pass...
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Article
Optimizing effectiveness and robustness for solar heat absorbers composed of a periodically nano-structured surface
This work studies solar heat absorbers having periodic and rectangular nano-pillars on their surfaces. Design factors are periods, filling ratios, and pillar height. They are tailored using the design of exper...
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Article
Response of Hydrogen Desorption and Hydrogen Embrittlement to Precipitation of Nanometer-Sized Copper in Tempered Martensitic Low-Carbon Steel
This work is aimed at studying the hydrogen–copper precipitate interaction in a martensitic steel. Analysis of hydrogen thermal desorption revealed that precipitation of copper particles enhances the hydrogen ...
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Article
Hierarchical Structure and Multifunctional Surface Properties of Carnivorous Pitcher Plants Nepenthes
Carnivorous pitcher plants of the genus Nepenthes have evolved specialized leaves fulfilling the multi-functions of attracting, capturing, retaining and digesting the prey, mostly arthropods. Different capturing ...
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Article
Tuning the Planar-Flow Melt-Spinning Process Subject to Operability Conditions
An amorphous structure improves the physical properties of metal and enhances material performance. Planar-flow melt-spinning (PFMS) is a rapid solidification process for producing microcrystalline and amorpho...
