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    Intermetallic growth between lead-free solders and palladium

    Intermetallic growth between Pd and the lead-free solders Sn-Ag and Sn-Ag-Cu has been studied. Diffusion couples were prepared by reflowing the solders on Pd and then aging the couples at 156°C, 175°C, 195°C, ...

    Gaurav Sharma, C. M. Eichfeld, S. E. Mohney in Journal of Electronic Materials (2003)