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Development of Packaging and Testing Industry

IC packaging increasingly plays a more important role in the More-than-Moore era. Wire bonding, flip chip, and through-silicon-via (TSV) are mainstream interconnection technologies since the 1960s. System-in-P...

Jian Cai, Guoliang Yu, Hongwei Sun, Jian Wu… in Handbook of Integrated Circuit Industry (2024)

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Integrated Circuits Packaging Reliability

Package reliability is a very important aspect for IC products and is studied for the improvement and optimization of package design, processes, and materials, etc., as well as the development of measurement, ...

Anjun Huang, Rongzheng Ding, Hanwu **ao, Jian Lu… in Handbook of Integrated Circuit Industry (2024)

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Halogenation Metallurgy

Zhao Zhongwei in The ECPH Encyclopedia of Mining and Metallurgy (2024)

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Tungsten Metallurgy

Zhao Zhongwei in The ECPH Encyclopedia of Mining and Metallurgy (2024)

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Nonferrous Metallurgy

Lu Huimin, Zhao Zhongwei in The ECPH Encyclopedia of Mining and Metallurgy (2024)

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Shrinkage Sto** Mining Method

Deng Hongwei in The ECPH Encyclopedia of Mining and Metallurgy (2024)

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Molybdenum Metallurgy

Zhao Zhongwei, Zhang Guiqing in The ECPH Encyclopedia of Mining and Metallurgy (2024)

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Separation of Tungstate and Molybdenum

Zhao Zhongwei in The ECPH Encyclopedia of Mining and Metallurgy (2024)

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Non-traditional New Structure Devices

With the rapid development of the integrated circuit (IC) process technology, IC device technology has made great advances. A variety of new structural and new principle devices are proposed to meet the needs ...

Yimao Cai, Jun Xu, Renrong Liang, Qianqian Huang… in Handbook of Integrated Circuit Industry (2024)