Page
%P
![Loading...](https://link.springer.com/static/c4a417b97a76cc2980e3c25e2271af3129e08bbe/images/pdf-preview/spacer.gif)
-
Chapter and Conference Paper
Investigation of Thermal Properties and Thermal Reliability of Ga-based Low Melting Temperature Alloys as Thermal Interface Materials (TIMs)
have been proposed as candidates for (TIMs) due to their high thermal conductivity (~30 W/m*K) and liquidity. However, poor wettability as well as embrittling and corroding effect of Ga on metals have limit...