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  1. No Access

    Article

    Effects of limited cu supply on soldering reactions between SnAgCu and Ni

    The volume difference between the various types of solder joints in electronic devices can be enormous. For example, the volume difference between a 760-µm ball grid array solder joint and a 75-µm flip-chip so...

    C. E. Ho, Y. W. Lin, S. C. Yang, C. R. Kao, D. S. Jiang in Journal of Electronic Materials (2006)

  2. No Access

    Article

    Tin Whisker Growth Induced by High Electron Current Density

    The effect of electric current on the tin whisker growth on Sn stripes was studied. The Sn stripes, 1 μm in thickness, were patterned on silicon wafers. The design of the Sn stripes allowed the simultaneous study...

    Y. W. Lin, Yi-Shao Lai, Y. L. Lin, Chun-Te Tu, C. R. Kao in Journal of Electronic Materials (2008)

  3. No Access

    Article

    Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration

    Flip-chip solder joints with Cu/Ni/Al underbump metallurgy (UBM) on the chip and an Au/Ni surface finish on the substrate were studied under current stressing at an ambient temperature of 150°C. Three differen...

    Y.L. Lin, Y.S. Lai, Y.W. Lin, C.R. Kao in Journal of Electronic Materials (2008)

  4. No Access

    Article

    Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates

    This study investigated the intermixing of 95Pb-5Sn solder bumps and 37Pb-63Sn pre-solder in flip-chip solder joints. The reaction conditions included multiple reflows (up to ten) at 240°C, whereby previously ...

    C. C. Chang, Y. W. Lin, Y. S. Lai, C. R. Kao in Journal of Electronic Materials (2009)

  5. No Access

    Article

    Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints

    The Ni(V) under bump metallization (UBM) in flip chip solder joints is known to be consumed in a two-stage process during current stressing. The Ni(V) UBM transforms first to the “consumed Ni(V)” state. Then, ...

    M. Y. Tsai, Y. L. Lin, Y. W. Lin, J. H. Ke, C. R. Kao in Journal of Electronic Materials (2010)

  6. No Access

    Article

    Electronic structure, charge transfer character and spectroscopic property of electroluminescent/photoluminescent [ZnL2] (HL = 2-(1H-benzo[d]imidazol-2-yl)-4-bromophenol) studied by density functional theory

    In this paper the DFT-/TDDFT-based theoretical calculation results of the electroluminescence/photoluminescence zinc(II) chelate complex [ZnL2] are presented, including the molecular geometry, electronic structur...

    Y. -P. Tong, Z. **, Y. -W. Lin in Journal of Structural Chemistry (2015)

  7. No Access

    Article

    A Density Functional Investigation of Geometrical and Electronic Structures, Charge Transfer, and Photoluminescent Property of a Zinc(II) Complex with 5-Amino-2-(1H-Benzoimidazol-2-yl)-Phenol

    In this paper the results of DFT/TDDFT-based theoretical calculations of an electroluminescent zinc(II) chelate complex with 5-amino-2-(1H-benzoimidazol-2-yl)-phenol (HL), namely [ZnL2] (1), are presented. The mo...

    Y.-P. Tong, Y.-W. Lin, H. Liu in Journal of Structural Chemistry (2018)