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    Influence of Microstructure Evolution on the Current Density and Temperature Gradient of Line-Type Cu/Sn58Bi/Cu Microscale Solder Joints Under Current Stressing

    Sn58Bi is a promising lead-free solder alloy for low-temperature soldering of electronic packaging. Because of the uneven distribution of the tin (Sn)- and bismuth (Bi)-rich phases, the microstructure of Sn58B...

    Hongbo Qin, Chuyi Lei, **nghe Luan, Quanzhang Wen… in Journal of Electronic Materials (2022)