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  1. No Access

    Article

    Phase transition and dam** behavior of Al matrix composites reinforced by a NiTi particle layer

    NiTip/1060Al lamellar composites exhibiting low-temperature phase transformation dam** characteristics were synthesized through composite rolling technology. This study explores the impact of varying volume ...

    Chaoyi Ding, Hongjie Jiang, Wangyun Li, Chongyu Liu… in Journal of Materials Science (2023)

  2. No Access

    Article

    Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density

    In this study, the shear performance and fracture behavior of microscale ball grid array (BGA) structure Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density ...

    Yubing Gong, Longgen Liu, Siliang He… in Journal of Materials Science: Materials in… (2022)

  3. No Access

    Article

    Effect of electric current stressing on mechanical performance of solders and solder joints: A review

    Mechanical performance is one of the most important factors influencing the reliability of solder joints. Heretofore, plenty of works have been conducted on reliability of solder joints under various mechanica...

    Bo Wang, Wangyun Li, Shuye Zhang, **ngmin Li, Kailin Pan in Journal of Materials Science (2022)

  4. No Access

    Article

    Creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints with increasing current density

    The creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints under current stressing with increasing electric current density (0 A/cm2, 5.0 × 103 A/cm2, 6.0 × 103 A/cm2, and 7.0 × 103 A/cm2) was inves...

    **ngmin Li, Jian Wang, Hongbo Qin… in Journal of Materials Science: Materials in… (2022)

  5. No Access

    Article

    Influence of Microstructure Evolution on the Current Density and Temperature Gradient of Line-Type Cu/Sn58Bi/Cu Microscale Solder Joints Under Current Stressing

    Sn58Bi is a promising lead-free solder alloy for low-temperature soldering of electronic packaging. Because of the uneven distribution of the tin (Sn)- and bismuth (Bi)-rich phases, the microstructure of Sn58B...

    Hongbo Qin, Chuyi Lei, **nghe Luan, Quanzhang Wen… in Journal of Electronic Materials (2022)

  6. No Access

    Article

    Shear performance of microscale ball grid array structure Sn–3.0Ag–0.5Cu solder joints with different surface finish combinations under electro-thermo-mechanical coupled loads

    The shear performance and fracture behavior of microscale ball grid array structure Sn–3.0Ag–0.5Cu solder joints with different substrate surface finishes (Cu with organic solderability preservatives and elect...

    Bo Wang, Wangyun Li, Kailin Pan in Journal of Materials Science: Materials in Electronics (2022)

  7. No Access

    Article

    Influence of phase inhomogeneity on the mechanical behavior of microscale Cu/Sn–58Bi/Cu solder joints

    Electronics are becoming smaller and more versatile, and the size of solder joints has decreased to tens of microns, inducing obvious inhomogeneity among the phases in the solder matrix microstructure. In this...

    Hongbo Qin, Wei Qin, Wangyun Li, Xu Long in Journal of Materials Science: Materials in… (2022)

  8. No Access

    Article

    Size effect on tensile performance of microscale Cu/Sn3.0Ag0.5Cu/Cu joints at low temperatures

    For the reliability of cryoelectronics, the tensile performance and fracture behavior of microscale Cu/Sn3.0Ag0.5Cu/Cu joints with shrinking size were investigated at decreasing temperature ranging from 25 °C ...

    Jun Gui, **ngmin Li, Jian Wang, Wangyun Li… in Journal of Materials Science: Materials in… (2021)