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Article
Preparation of NiTip/Al composites with controllable phase transformation and dam** behavior by friction stir processing
The NiTip/1060Al composites were prepared using a pre-aging and friction stir method (FSP) to enhance the low-temperature dam** performance of the aluminum alloy and accommodate various service temperatures....
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Article
Phase transition and dam** behavior of Al matrix composites reinforced by a NiTi particle layer
NiTip/1060Al lamellar composites exhibiting low-temperature phase transformation dam** characteristics were synthesized through composite rolling technology. This study explores the impact of varying volume ...
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Article
Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density
In this study, the shear performance and fracture behavior of microscale ball grid array (BGA) structure Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density ...
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Article
Effect of electric current stressing on mechanical performance of solders and solder joints: A review
Mechanical performance is one of the most important factors influencing the reliability of solder joints. Heretofore, plenty of works have been conducted on reliability of solder joints under various mechanica...
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Article
Creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints with increasing current density
The creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints under current stressing with increasing electric current density (0 A/cm2, 5.0 × 103 A/cm2, 6.0 × 103 A/cm2, and 7.0 × 103 A/cm2) was inves...
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Article
Influence of Microstructure Evolution on the Current Density and Temperature Gradient of Line-Type Cu/Sn58Bi/Cu Microscale Solder Joints Under Current Stressing
Sn58Bi is a promising lead-free solder alloy for low-temperature soldering of electronic packaging. Because of the uneven distribution of the tin (Sn)- and bismuth (Bi)-rich phases, the microstructure of Sn58B...
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Article
Shear performance of microscale ball grid array structure Sn–3.0Ag–0.5Cu solder joints with different surface finish combinations under electro-thermo-mechanical coupled loads
The shear performance and fracture behavior of microscale ball grid array structure Sn–3.0Ag–0.5Cu solder joints with different substrate surface finishes (Cu with organic solderability preservatives and elect...
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Article
Influence of phase inhomogeneity on the mechanical behavior of microscale Cu/Sn–58Bi/Cu solder joints
Electronics are becoming smaller and more versatile, and the size of solder joints has decreased to tens of microns, inducing obvious inhomogeneity among the phases in the solder matrix microstructure. In this...
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Article
Size effect on tensile performance of microscale Cu/Sn3.0Ag0.5Cu/Cu joints at low temperatures
For the reliability of cryoelectronics, the tensile performance and fracture behavior of microscale Cu/Sn3.0Ag0.5Cu/Cu joints with shrinking size were investigated at decreasing temperature ranging from 25 °C ...