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    Properties of FeSe nanobridges prepared by using a focused ion beam

    We have fabricated FeSe nanobridges by using a focused ion beam (FIB) etching technique and studied their transport properties. FeSe films were prepatterned into microbridges by using a standard photolithograp...

    Sung-Hak Hong, Soon-Gul Lee, Soon-Gil Jung in Journal of the Korean Physical Society (2012)

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    Fabrication of BaKFeAs intergrain nanobridges by using a focused ion beam

    We have studied the fabrication and the transport properties of Ba0.6K0.4Fe2As2 intergrain nanobridges patterned by using a focused ion beam (FIB). Prior to FIB etching, 8-µm-wide bridges were prepatterned from B...

    Sung-Hak Hong, Sung Hoon Lee, Soon-Gul Lee in Journal of the Korean Physical Society (2012)

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    Interfacial reaction and solder joint reliability of Pb-free solders in lead frame chip scale packages (LF-CSP)

    Chip scale packages (CSP) have essential solder joint quality problems, and a board level reliability is a key issue in design and development of the CSP type packages. There has been an effort to eliminate Pb...

    Seung Wook Yoon, Chang Jun Park, Sung Hak Hong in Journal of Electronic Materials (2000)