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Article
Properties of FeSe nanobridges prepared by using a focused ion beam
We have fabricated FeSe nanobridges by using a focused ion beam (FIB) etching technique and studied their transport properties. FeSe films were prepatterned into microbridges by using a standard photolithograp...
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Article
Fabrication of BaKFeAs intergrain nanobridges by using a focused ion beam
We have studied the fabrication and the transport properties of Ba0.6K0.4Fe2As2 intergrain nanobridges patterned by using a focused ion beam (FIB). Prior to FIB etching, 8-µm-wide bridges were prepatterned from B...
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Article
Interfacial reaction and solder joint reliability of Pb-free solders in lead frame chip scale packages (LF-CSP)
Chip scale packages (CSP) have essential solder joint quality problems, and a board level reliability is a key issue in design and development of the CSP type packages. There has been an effort to eliminate Pb...