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  1. No Access

    Article

    High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

    This paper presents a comprehensive study of the resistance of solder joints to failure when subjected to strain rates that simulate the conditions of drop impact experienced by a portable electronic product. ...

    E.H. Wong, S.K.W. Seah, C.S. Selvanayagam, R. Rajoo… in Journal of Electronic Materials (2009)

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    Article

    Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

    The stress–strain properties of eutectic Sn-Pb and lead-free solders at strain rates between 0.1 s−1 and 300 s−1 are required to support finite-element modeling of the solder joints during board-level mechanical ...

    E.H. Wong, C.S. Selvanayagam, S.K.W. Seah… in Journal of Electronic Materials (2008)

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    Article

    An interdisciplinary perspective on artificial immune systems

    This review paper attempts to position the area of Artificial Immune Systems (AIS) in a broader context of interdisciplinary research. We review AIS based on an established conceptual framework that encapsulat...

    J. Timmis, P. Andrews, N. Owens, E. Clark in Evolutionary Intelligence (2008)