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Article
Abnormal Cu Grain Growth by External Stress on Electroplated Cu Films
In this study, the effect of external stress on the Cu microstructure evolution of electroplated Cu films was studied. We found that, with applying external compressive stress, abnormal grain growth occurred i...
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Article
Effect of expelling P content on Ni(P) dissolution and reaction with SnAgCu(Ni)
The present work studied the crystallinity effecting of Ni(P) layer on the interfacial reaction between SAC1205-0.05Ni solder and electroless-Ni(P)/electroless-Pd(P)/immersion-Au (ENEPIG) surface finish. By TE...
