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    Article

    Abnormal Cu Grain Growth by External Stress on Electroplated Cu Films

    In this study, the effect of external stress on the Cu microstructure evolution of electroplated Cu films was studied. We found that, with applying external compressive stress, abnormal grain growth occurred i...

    Jui-Sheng Chang, Chung-Yu Chiu, Yu-Chen Huang, Ting-Yi Cheng, Zhong-Yen Yu in JOM (2024)

  2. Article

    Open Access

    Establishing an astaxanthin-rich live feed strain of Pseudodiaptomus annandalei

    This study aimed to establish an astaxanthin-rich strain of the calanoid copepod Pseudodiaptomus annandalei, through selective breeding based on RGB (red, green and blue) value, a parameter indicating color inten...

    Sen Chan, Yen-Ju Pan, Ang Lu, Chang-Wen Huang, Ji-Long Liao in Scientific Reports (2024)

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    Article

    Effect of expelling P content on Ni(P) dissolution and reaction with SnAgCu(Ni)

    The present work studied the crystallinity effecting of Ni(P) layer on the interfacial reaction between SAC1205-0.05Ni solder and electroless-Ni(P)/electroless-Pd(P)/immersion-Au (ENEPIG) surface finish. By TE...

    Ya-Hui Hsu, Mei-Hsin Lo, Yu-Chun Lee in Journal of Materials Science: Materials in… (2024)