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Article
Estimation of the Interfacial Fracture Energy of Metal/Polymer System in Microelectronic Packaging
The interfacial fracture energies of flexible Cu/Cr/Polyimide system were deduced from the T peel test. The T peel strength and peel angle were strongly affected by the metal thickness and the biased rf plasma...
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Article
Effect of phosphorous content on phase transformation induced stress in Sn/Ni(P) thin films
The film stress evolutions induced by the phase transformation of Sn/Ni(P) films during thermal treatment were investigated using an in situ measurement of wafer curvature by laser scanning. Apparently, tensil...
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Article
Analysis of Phase Transformation Kinetics by Intrinsic Stress Evolutions During the Isothermal Aging of Amorphous Ni(P) and Sn/Ni(P) Films
The kinetics for the crystallization of amorphous Ni(P) films and the formation of intermetallic compounds in Sn/Ni(P) films during isothermal aging treatment were studied with in situ intrinsic stress measure...