Abstract
Single-crystal materials are widely used in optics and electronics field and are essential in condensed matter physics and materials science researches. However, the hard and brittle nature of the materials prevents it from manufacturing intricate features and optical quality surfaces. Nanometric cutting assisted with ion implantation surface modification method reduces the fracture and tool wear during machining by improving the surface mechanical properties. The mechanism, techniques, and applications of this method are specifically explained in the chapter.
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References
Caturla M-J, Diaz de la Rubia T, Marques LA, Gilmer GH (1996) Ion-beam processing of silicon at keV energies: a molecular-dynamics study. Phys Rev B 54:16683–16695
Chao WL, Harteneck B, Liddle J, Anderson E, Attwood D (2005) Soft X-ray microscopy at a spatial resolution better than 15 nm. Nature 435:1210–1213
Chen YH, Fang FZ, Xu ZW, Zhang XD, Hu XT (2012) Surface modification for brittle monocrystalline materials by MeV ions. Nucl Instrum Methods Phys Res B 272:433–436
Cheong WCD, Zhang LC (2000) Molecular dynamics simulation of phase transformations in silicon monocrystals due to nano-indentation. Nanotechnology 11:173–180
Decoster G, Vantomme A (2009) Transition metal impurities on the bond-centered site in Germanium. Phys Rev Lett 102:065502–065506
Fang FZ, Liu YC (2004) On minimum exit-burr in micro cutting. J Micromech Microeng 14:984–988
Fang FZ, Venkatesh VC (1998) Diamond cutting of silicon with nanometric finish. CIRP Ann Manuf Technol 47(1):45–49
Fang FZ, Wu H, Zhou W, Hu XT (2005) Modelling and experimental investigation on nanometric cutting of monocrystalline silicon. Int J Mach Tool Manuf 45(15):1681–1686
Fang FZ, Wu H, Zhou W, Hu XT (2007) A study on mechanism of nano-cutting single crystal silicon. J Mater Process Technol 184(1–3):407–410
Fang FZ, Chen YH, Zhang XD, Hu XT, Zhang GX (2011) Nanometric cutting of single crystal silicon surfaces modified by ion implantation. CIRP Ann Manuf Technol 60(1):527–530
Hensel H, Urbassek H (1998) Implantation and damage under low-energy Si self-bombardment. Phys Rev B 57:4756–4763
Mayer J, Giannuzzi LA, Kamino T, Michael J (2007) TEM sample preparation and FIB-induced damage. MRS Bull 32:400–407
Pelaz L, Marque’s LA, Barbolla J (2004) Ion-beam-induced amorphization and recrystallization in silicon. J Appl Phys 96(11):5947–5976
Plimpton S (1995) Fast parallel algorithms for short-range molecular dynamics. J Comp Phys 117:1–19
Stephenson PCL, Radny MW, Smith PV (1996) A modified stillinger-weber potential for modelling silicon surfaces. Surf Sci 366(1):177–184
Tersoff J (1988) New empirical approach for the structure and energy of covalent systems. Phys Rev B 37:6991–7000
Wang S, Yuan T, Walsby ED, Blaikie RJ, Durbin SM, Cumming DRS, Xu J, Zhang XC (2002) Characterization of T-ray binary lenses. Opt Lett 27(13):1183–1185
Yan J, Yoshino M, Kuriagawa T, Shirakashi T, Syoji K, Komanduri R (2001) On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications. Mater Sci Eng A 297(½):230–234
Yan J, Takahashi H, Tamaki J, Gai X, Harada H, Patten J (2005) Nanoindentation tests on diamond-machined silicon wafers. Appl Phys Lett 86:181913–181917
Zhang LC, Zarudi I (2001) Towards a deeper understanding of plastic deformation in mono-crystalline silicon. Int J Mech Sci 43(9):1985–1996
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© 2013 Springer-Verlag London
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Chen, Y., Fang, F. (2013). Nanometric Cutting of Crystal Surfaces Modified by Ion Implantation. In: Nee, A. (eds) Handbook of Manufacturing Engineering and Technology. Springer, London. https://doi.org/10.1007/978-1-4471-4976-7_70-3
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DOI: https://doi.org/10.1007/978-1-4471-4976-7_70-3
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