Abstract
Solder fatigue is quite important for the reliability of IGBTs under thermal cycling. In this work, a Finite Elements Analysis-Fatigue Damage Calculation/Feedback (FEA-FDC) iterative loo** was proposed for the evolution of micro-cracks in the solder layer of IGBTs. Secondly, the crack initiation and propagation in chip solder layer was investigated under power cycling (PC) by the iterative loo**. Furthermore, the crack initiation and propagation in chip solder layer under lower temperature swings (<20K) was investigated. Finally, the degradation in thermal characteristics of IGBTs under PWM operations was evaluated and then a fatigue lifetime prediction method of IGBT under lower temperature swings was proposed. This work may provide a new insight for evaluating the reliability of IGBTs under their normal operating.
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Acknowledgement
This work was supported by National Defense Science and Technology Key Laboratory Foundation (6142217190401), Science Foundation of Naval University of Engineering (425317S131).
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Huang, Y., Luo, Y., **ao, F., Liu, B., Tang, X. (2023). Lifetime Evaluation of IGBTs Under PWM by a Physical Iterative Simulation Loop Based on the Crack Initiation and Propagation in Chip Solder Layer. In: Li, J., **e, K., Hu, J., Yang, Q. (eds) The Proceedings of the 17th Annual Conference of China Electrotechnical Society. ACCES 2022. Lecture Notes in Electrical Engineering, vol 1013. Springer, Singapore. https://doi.org/10.1007/978-981-99-0451-8_132
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DOI: https://doi.org/10.1007/978-981-99-0451-8_132
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